Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > Embedded

Sub-1GHz RF chip integrated MCU suits wireless apps

Posted: 30 Apr 2010     Print Version  Bookmark and Share

Keywords:RF chip  MCU  wireless apps 

From Texas Instruments Incorporated (TI) come the CC430F513x microcontrollers that combine the ultra-low power MSP430 MCU with the high performance sub-1GHz CC1101 RF transceiver. It is supported by a rich developer ecosystem that offers complete, scalable hardware and software solutions for wireless networking.

The CC430F513x devices offer up to 20MIPS performance in a small package (7mm x 7mm) and support security options such as an integrated AES hardware module. TI is also expanding its LCD product offering with the CC430F61xx series of devices, providing developers with more options to meet varying design needs. With the capability to support multiple protocols and a broad frequency range, the CC430 MCUs, along with the extensive third party ecosystem, spur innovation in applications like home and building automation, smart metering, energy harvesting, asset tracking and portable medical applications. Developers can also immediately jumpstart CC430 MCU-based designs with the EM430F6137RF900 and eZ430-Chronos wireless development tools that include all the hardware design information required to develop a complete wireless project.

CC430 MCUs include eight devices that offer non-LCD (CC430F513x) and LCD (CC430F61xx) options, as well as a range of pin count, memory and high-performance analogue integration to meet varying design needs. For LCD-based applications, the CC430F61xx MCU with integrated LCD capabilities reduces system cost and size.

The ultra-low power MSP430 MCU core and sub-1GHz CC1101 RF transceiver are combined on one chip to reduce system complexity and shrink package and printed circuit board (PCB) size by up to 50 per cent compared to two-chip solutions. The devices draw low enough current to enable battery-operated wireless networking applications that operate without servicing for several years, reducing maintenance costs and overall BOM.

The eZ430-Chronos and EM430F6137RF900 are complete wireless development kits that provide all the hardware and software supports necessary to instantly develop and deploy projects. The broad, innovative third party ecosystem of hardware and software developers include AMBER Wireless, BM innovations, the DASH7 Alliance, Digikey, IAR Systems, LS Research, Sensinode, Steinbeis Transfer Centre Embedded Design and Networking, and Virtual Extension

Software stacks and protocols are an important factor in making it easy and reduce time to market for developers. TI is working closely with industry leading third party developers to bring various industry accepted software stacks to customers. Examples include 6LoWPAN (building control, lighting control and smart grid), Wireless MBUS (smart metering), Opentag, an open source firmware library for DASH7(building automation, smart grid, asset tracking), VEmesh (wireless mesh smart meter and sensor networking) and BlueRobin (personal health and fitness) solutions.

Production quantities of the CC430F513x MCUs are immediately available to order starting at Rs.191.63 ($4.15) (1000 units). Sampling in May, the CC430F61xx family with integrated LCD is also immediately available to order and pricing starts at Rs.200.87 ($4.35) (1000 units). Developers can place orders at TI's website.

Comment on "Sub-1GHz RF chip integrated MCU suit..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top