Spansion taps ChipMOS for wafer sort services

Spansion LLC has chosen ChipMOS Technologies Inc. for a two-year wafer sort services agreement utilising the V5400 test platform. The agreement makes ChipMOS Taiwan the exclusive wafer sort subcontractor of Spansion, except for any sort equipment operated by Spansion LLC or currently located at Spansion Japan Ltd.

S.J. Cheng, chairman and CEO of ChipMOS indicated, "ChipMOS and Spansion have continued to work together in what has been the worst global economic downturn in memory. We believe the existing capacity in ChipMOS can fully support Spansion for the company's long-term success. We look forward to continuing to provide the high-quality semiconductor testing services for Spansion that our customers rely on us for."

"ChipMOS has been a tremendous long-term ally and strategic wafer sort service provider to Spansion," said John Kispert, Spansion president and CEO. "We are pleased with this new long-term agreement and look forward to succeeding together."

The wafer sort services agreement will become effective upon the earlier of the date the U.S. Bankruptcy Court enters an order approving the agreement, and such order is not stayed pending appeal, or the date a plan of reorganisation for Spansion is confirmed by the U.S. Bankruptcy Court and becomes effective.