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IPAD 500µm Flip Chip: package description and recommendations for use

Posted: 09 Apr 2010     Print Version  Bookmark and Share

Keywords:Flip Chips  package description  IPAD flip chip 

This application note provides package and usage recommendation information for 500µm pitch Flip Chips. The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce the dimension of their products, STMicroelectronics has developed packages with reduced size, thickness and weight in the form of the Flip Chip.

The electrical performance of such components in Flip Chips is improved thanks to shorter connections than the ones in standard plastic packages (such as TSSOP, SSOP or BGA).

View the PDF document for more information.

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