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EE Times-India > EDA/IP

Hurdling the issues of IC reliability

Posted: 25 Mar 2010     Print Version  Bookmark and Share

Keywords:IC reliability  CMOS processes  IC industrial issues 

Advanced short-geometry CMOS processes are subject to ageing that causes major reliability issues, degrading the performance of ICs over time. Two of the most problematic effects causing ageing are hot carrier injection (HCI) and negative bias temperature instability (NBTI). Below 90nm, consideration of the effects of HCI and NBTI is becoming mandatory for design flows targeting quality and reliability.

This article describes the industrial challenges associated with accurate modelling of ageing problems, with a particular emphasis on NBTI. Particularly, a tight relation exists between design and reliability issues, and state-of-the-art simulation flows can help designers address these issues to create more reliable designs.

View the PDF document for more information.

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