Board support package pushes TI's OMAP 3 EVM

Embedded device software solutions provider Bsquare Corp. revealed an optimised Microsoft Windows Embedded CE 6.0 R3 board support package (BSP) designed for the Texas Instruments Inc. OMAP 3 evaluation module (EVM).

The new Windows Embedded CE 6.0 R3 BSP ships with OpenGL ES 2.0 technology that takes advantage of the TI OMAP35x 3D PowerVR SGX graphics engine, which allows OEMs to use advanced Silverlight for Windows Embedded user interface (UI) solutions on the TI hardware.

"Bsquare's BSP allows us to differentiate our OMAP 3 platform for a wide range of device manufacturers who want the benefits of speed and high performance coupled with rich Internet applications, immersive user experience and seamless connectivity to other Windows PCs, servers and online services," said Gerard Andrews, OMAP 3 product line manager at TI.

"With Windows Embedded CE 6.0 R3 and the TI OMAP3 platform as building blocks, OEMs gain a significant time-to-market advantage. Using familiar development tools and leveraging the high-performance graphics and advanced multimedia support the new BSP enables, OEMs and ODMs can create highly differentiated devices that feature compelling experiences," said Raj Khera, Bsquare's VP of products.

The new BSP also supports Internet Explorer Embedded, Microsoft Office and PDF viewers and Tencent's QQ Messenger Client. Bsquare is a licensing distributor of Windows Embedded CE 6.0 R3 and offers Microsoft's complete line of software products for embedded systems to OEMs in North America.

The Windows Embedded CE 6.0 R3 BSP will be available for free in Q4 09 with the purchase of a TI OMAP35x EVM.

For application notes and technical articles on processors, visit Embedded Design India.