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Intersil signs power MOU with Tower Semi

Posted: 17 Aug 2009     Print Version  Bookmark and Share

Keywords:power management  analogue IC  CMOS 

Intersil Corp. and Tower Semiconductor Ltd have entered a memorandum of understanding (MOU) jointly develop a high-performance power management speciality process technology platform.

The multi-year agreement will combine Tower's technology expertise with Intersil's design and process technology capabilities to provide Intersil with a powerful and innovative platform, accelerating its power management product growth to address next-generation requirements. Intersil will utilise the platform to manufacture its power ICs in Tower's 200mm facility in Migdal Ha'emek, Israel.

According to Gartner Inc.'s Forecast for Power Management ICs Worldwide, 2007-2012, power management devices will continue to be the fastest growth segment of any analogue IC category. iSuppli reports the power management IC market is expected to grow from Rs.50,313.57 crore ($10.3 billion) in 2009 to Rs.71,318.27 crore ($14.6 billion) in 2013, a CAGR of 9.1 per cent.

Intersil already has an established relationship with Jazz Semiconductor, Tower's wholly owned subsidiary, utilising previous generation power management platforms. This new collaboration will enable further engineering relationships across a wide set of process technologies that could bring additional business to both companies.

Tower's Bipolar-CMOS-DMOS (BCD) power process offering is highly modular and includes a unique Y-Flash zero mask adder non-volatile memory solution. Combined with Intersil's power management design and process capabilities, this new process will go beyond its base platform to specifically address the requirements of multiple Intersil product families including digital power, PWM controllers and PMICs for a broad set of end user markets such as consumer, computing, communications, industrial and automotive. "Tower provides best-in-class BCD process technology which enables Intersil to offer highly-differentiated power management and non-volatile memory solutions," said Sagar Pushpala, senior VP for worldwide operations and technology at Intersil.

Commenting on the signing of the MOU, Russell Ellwanger, Tower CEO said, "Intersil offers quality, high-performance analogue ICs and we are excited that a proven leader in power management has chosen us as their partner and placed their trust in our technology and roadmap to co-develop and manufacture their next-generation power platform. Together, we will enable faster design cycles and cost-effective designs which will be very advantageous for Intersil's customers."

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