Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > Manufacturing/Packaging

Intro to Flip-Chip CSP

Posted: 14 Jul 2009     Print Version  Bookmark and Share

Keywords:Flip-chip  chip scale  plastic package 

The competitive market of portable equipment is driven by a challenging development of highly integrated products.

To allow portable equipment manufacturers to reduce the dimension of their products, STMicroelectronics has developed packages with reduced size, thickness and weight in the form of the Flip-Chip chip scale package (CSP).

The electrical performances of such components in Flip-Chip CSP are improved, thanks to shorter connections compared to standard plastic packages (as TSSOP, SSOP or BGA).

This Flip-Chip CSP family has been designed to fulfil the same quality levels and the same reliability performances as standard semiconductor plastic packages. That means these new flip-chip packages have to be considered as new SMDs, which will be assembled on a PCB without any special or additional process steps required. In particular, this package does not require any extra under fill to increase reliability performances or to protect the device. Furthermore, this package is compatible with existing pick and place equipment for board mounting.

This document outlines the Flip-Chip CSP features and specifies how ST's customers can use them. This application note addresses the following items: product description, mechanical description, packing specifications and labelling description, recommended storage and shipping instructions, soldering assembly recommendations, user responsibility and returns, changes, delivered quantity, and quality.

View the PDF document for more information.

Comment on "Intro to Flip-Chip CSP"
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top