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Solder reflow attach method for RF devices

Posted: 01 Jun 2009     Print Version  Bookmark and Share

Keywords:solder reflow  RF transistors  over-moulded plastic 

This application note by Freescale aims to provide a guideline for solder reflow mounting of high power RF transistors and ICs in over-moulded plastic packages. This document aids customers in developing an assembly process suitable for their design and their manufacturing operation. Each power amplifier (PA) design has its own unique performance requirements. Similarly, each manufacturing operation also has its own process capabilities. Therefore, each design and assembly may require some fine- tuning. The intent of this application note is to provide the information our customers need to establish the process that is most suitable for their design and compatible with their manufacturing operations. When designing and manufacturing PA systems, electrical, thermal, quality, and reliability factors must be considered.

View the PDF document for more information.

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