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Estimate surface mounted IC temp rise

Posted: 03 Apr 2009     Print Version  Bookmark and Share

Keywords:temperature rise  electrical analogue  heat sink 

It used to be fairly simple to estimate semiconductor temperature rise. You would just figure out the power dissipated in the component and use a cooling circuit's electrical analogue to figure out what kind of heat sink was needed.

Now, however, the problem has been complicated by the strong desire to eliminate heat sinks for size and cost reasons. Semiconductors mounted in thermally enhanced packages require the circuit board to function as the heat sink and provide all necessary cooling. Heat flows through a metal mounting tab and package leading into the printed wiring board (PWB). The heat then flows laterally though PWB traces and through the surface of the board by natural convection to the ambient. The significant factors influencing the die temperature rise are the amount of copper in the PWB and the surface area available for convection heat transfer.

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