Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > Power/Alternative Energy
Power/Alternative Energy  

Package packs more power in less space

Posted: 23 Feb 2009     Print Version  Bookmark and Share

Keywords:package  power semiconductors  footprint 

NEC Electronics Europe has launched package HSON-8, which combines the small footprint of a SOP-8 package with the thermal and electrical properties of a DPAK (aka TO-252). The device, designed for power semiconductors in automotive applications, offers similar performance as widespread packages at lower space requirements.

HSON-8 can reduce the footprint for power semiconductors by 50 per cent, claimed NEC. This is of particular interest in applications where space is limited such as ABS and fuel injection systems. Despite its smaller size, HSON-8 devices are pin-compatible with comparable products from competitors, a company spokesperson explained.

HSON-8 features include 75A capacity. For this reason, it enables the design of semiconductors with particular low RDS(on). For instance, if combined with NEC's proprietary UMOS-4 trench technology it allows for n-channel components with an RDS(on) of 5.1 mΩ. Currently, products are under development with break-through voltages of -30V, 40V and 60V, NEC Europe said.

Currently are two power transistors in the new package available; the n-channel transistor NP75N04UG and the p-channel device NP7503DG. Both meet the AEC-101 automotive quality standard.

The package is NEC proprietary. The company has no plans make it a standard by submitting the specifications to a standardisation body, the spokesperson said.

- Christoph Hammerschmidt
EE Times Europe

Comment on "Package packs more power in less spa..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top