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EE Times-India > EDA/IP

Synopsys CEO sees delays in 32-/28-nm era

Posted: 19 Jan 2009     Print Version  Bookmark and Share

Keywords:32-/28nm processes  IC design  process technology 

Who's the king?
TSMC's 32nm process is slated for shipment by the end of 2009. TSMC's first high-k/metal-gate offering, which is a 28nm process, is slated for the first quarter of 2010.

In comparison, IBM's Corp.'s "fab club," including Chartered, IBM and Samsung, is supposed to ship the high-k technology based on 32nm feature sizes by the second half of 2009.

Intel, considered the leader in logic process technology, is on track for 32nm production readiness in Q4 09. For some time, Intel has been shipping 45nm designs based on a high-k/metal-gate scheme.

In NAND, the Micron/Intel duo is leading the charge, as the companies are shipping 34nm parts. Seeking to take the technology lead in NAND flash, SanDisk Corp. disclosed that it will roll out 32nm devices in 2009. SanDisk's partner, Toshiba Corp., will also reportedly roll out 32nm NAND chips in the later part of 2009.

- Mark LaPedus
EE Times

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