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ASML describes 22nm litho road map

Posted: 01 Dec 2008     Print Version  Bookmark and Share

Keywords:lithography systems  22nm  single-patterning  EUV systems 

Double-patterning litho pains
Separately, senior engineering executives gave some details about the targets and challenges facing the double patterning litho systems. The targets, set in meetings in 2005, included more than doubling throughput, to as much as 250 wafers per hour, and slashing alignment margins to within 2nm.

To hit those targets, the wafer carriers shifted to guidance systems using long horizontal inferometer beams to short vertical ones. ASML will employ new materials on the magnetically levitated wafer carriers so they can accelerate at rates up to 150m/s2, nearly twice the rate of carriers in its current immersion systems.

"If a human being was sitting on this wafer carrier, he would not survive because it is too violent," said Harry van der Schoot, a senior designer on ASML's double patterning system.

The company is also developing new image-correction systems based on capabilities acquired in 2007 with Brion Technologies Inc.

ASML completed a new factory at its headquarters, where the double patterning systems are being produced. The company is also constructing another factory where it will make the EUV systems.

- Rick Merritt
EE Times

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