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SSD touts compact size

Posted: 10 Nov 2008     Print Version  Bookmark and Share

Keywords:Solid State Disk  direct board mounting  board interconnects 


Austin Semiconductor, Inc. announced a smaller, more compact 7.5 cm3 (31mm sq x 7.8mm max height) ruggedised Solid State Disc (SSD). The newly redesigned Solid State Disc (SSD) supports an embedded IDE, PIO/4 interface, has MTBF of more than 20 lakh hours and is ideal for harsh environment operation (0-70oC operations with future -40oC to +85oC).

"The device is intended for direct board mounting and has redundant board interconnects to increase the overall product reliability, which makes it ideal for handheld applications," says Frank Muscolino, President of Austin Semiconductor.

The solid state disc is based on a proprietary package (die) stacking technology to create an extremely space conscious, robust Solid State Disk. The SSD is capable of operating in harsh, vibration prone product platforms such embedded computing applications, heavy transportation, ultra portables, handhelds, mobile computing, digital radio, high-speed networking & enterprise applications, as well as, military, aerospace and industrial applications.


* SLC NAND FLASH Controller

* (2) stacks, each containing (1, 2 or 4) NAND components

* Each NAND component, either a 4,8 or 16Gb device, based on the use of single silicon and stacked silicon solutions

* Providing a total bit density of either 4,8 or 16GB

* Controller contained in base interposer

* Fast ATA host to buffer transfer rates supporting True IDE, PIO/4 mode support

* 512Byte Sector Buffers

* Flash Memory power-down logic

* ECC correction = 6 Bytes within a 512 Byte sector

* Automatic Sleep Mode

* Burst Transfer rate, 16.67MB per second

* Sustained Transfer rate: 6.7MB per second

* Built-In Wear Leveling

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