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USB 2.0 PCB guidelines for ArcticLink Solutions Platform

Posted: 03 Nov 2008     Print Version  Bookmark and Share

Keywords:USB 2.0  ArcticLink Solutions Platform  On-The-Go 

This document offers guidelines for component placement and PCB routing of the USB 2.0 portion of the QuickLogic ArcticLink Solutions Platform. Follow the recommendations in this application note to get the optimum signal quality on the USB bus and to minimise problems related to signal integrity.

In addition to other components, the ASSP part contains a Hi-Speed USB 2.0 On-The-Go sub-system that is capable of transferring data at speeds of 480 MHz. To achieve the maximum speed with the highest signal quality, special attention must be taken during the PCB design around the area of the Hi-Speed USB 2.0 sub-system. A clean analogue power rail and a stable clock must be provided to the USB portion of the ArcticLink Solutions Platform.

View the PDF document for more information.

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