Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

MicroTCA chassis tout modified front panel

Posted: 23 Sep 2008     Print Version  Bookmark and Share

Keywords:ruggedised MicroTCA  chassis  rack-mount 

Elma Electronic Inc. has unveiled ruggedised MicroTCA enclosures in a 19-inch rack-mount format. The 19-inch enclosures are designed to meet MIL-STD-810F, 167, 461D, and 901D. Standard ruggedisation techniques can be utilised including a shock isolated card cage and device mounting. Rugged chassis shells are incorporated using thick aluminium sheets, extrusions, and die-castings.

The MicroTCA chassis features modified front panels that can be secured to the chassis. This provides more protection for shock and vibration. Shock absorbers/dampers are also available for extra protection. Thermal management can be achieved via either convection or conduction cooling.

The MicroTCA backplane provides six AMC, one MCH and one PM (to 600W) slots. Optimised via signal integrity studies, the backplane supports PCI-Express, Serial Rapid I/O and 10GBase-BX4 Switching. It features direct SATA/SAS connections and 3 synchronisation clock networks. Other configurations are available.

Other chassis features include front-to-rear evacuative cooling, line filter, GND stud, shielded relay, IO panel, USB port, and fuse holder. The removable fan tray has 1x (120 x 120 mm) and 2x (40 x 40mm) fans and a finger guard.

The product is available at less than Rs.8,602.12 ($7500), depending on volume and options, with lead time of four to six weeks.

-Gina Roos
eeProductCenter





Comment on "MicroTCA chassis tout modified front..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top