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Packaging solution allows enhanced miniaturisation

Posted: 22 Sep 2008     Print Version  Bookmark and Share

Keywords:integrated module board  turnkey manufacturing  smaller boards  packing solution 

Imbera Electronics introduces its next generation integrated module board (IMB) technology, available across Imbera's full range of turnkey manufacturing services. IMB technology allows OEMs/ODMs to produce smaller boards, quickly and in a cost-effective manner by making simple adaptations to existing manufacturing processes. The advanced packing solution already has considerable momentum, with early customer-wins including a contract with Ibiden, the world's number one PCB manufacturer.

Imbera's manufacturing process combines PCB manufacturing, component packaging and component assembly into a single manufacturing sequence. The benefit of this shortened process means less materials and equipment are needed, logistics are simplified and less labour is required. All this leads to a robust technology that provides further product miniaturisation with very competitive total cost of ownership.

Due to its novel and advanced manufacturing process, IMB technology can be used to embed components inside a module substrate and manufacture a typical multi-chip-module / System-In-Package (SIP) product. Alternatively IMB technology can be used to embed the components inside a motherboard to manufacture a System-In-Board (SIB) product. The technology can be utilised in various applications from simple products with only a few components to demanding products, such as mobile phones and other portable products requiring high packaging density as well as good electrical and thermal performance.

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