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Spansion extends foundry agreement with SMIC

Posted: 25 Aug 2008     Print Version  Bookmark and Share

Keywords:foundry agreement  65nm MirrorBit NOR  MirrorBit Ornand2  memory devices 

Spansion Inc. has expanded its foundry arrangement with China's Semiconductor Manufacturing International Corp. (SMIC) to include 43nm production.

As part of the plan, NOR-flash memory supplier Spansion has extended its current agreement with SMIC for the production of 65nm MirrorBit NOR to include the manufacture of 43nm MirrorBit Ornand2 memory devices on 300mm wafers.

Based on the company's MirrorBit charge trapping technology, MirrorBit Ornand2 is designed to support faster write performance and a broad range of densities.

At present, Spansion is selling 65nm NOR devices. After completing development at its Sub-micron Development Centre (SDC) in Sunnyvale, Spansion plans to transition 43nm technology to SMIC's 300mm facility in Wuhan, China.

Concurrently, Spansion also plans to ramp production of its 45nm products such as EcoRAM, MirrorBit NOR and Eclipse at its own SP1 300mm wafer fabrication facility in Aizu-Wakamatsu, Japan by 2009.

Spansion expects to complete the development of 32nm MirrorBit technology for MirrorBit ORNAND2, MirrorBit Eclipse and Spansion EcoRAM at its SDC facility and ramp the technology to production in 2010.

Spansion, a NOR supplier, appears to be in a process race with its main rival. Numonyx B.V., the second largest NOR vendor, recently signed on its first silicon foundry partner, by announcing a deal with Japan's Elpida Memory Inc.

Under the terms, Elpida will make NOR-based flash memory devices in its 300mm wafer fab in Hiroshima for Numonyx. Elpida will make 65nm and 45nm devices on a foundry basis for the flash-memory vendor. DRAM specialist Elpida recently entered the foundry market, as part of a deal with Taiwan's United Microelectronics Corp. (UMC).

- Mark LaPedus
EE Times





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