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USB module uses SiP, 3D technology

Posted: 22 Aug 2008     Print Version  Bookmark and Share

Keywords:USB module  NAND flash memory  USB flash drive  3D die stacking 

STATS ChipPAC Ltd has announced an innovative USB module for NAND flash memory applications. The new USB flash drive design uses System-in-Package (SiP) and 3D die stacking technology to integrate NAND flash memory die, controller and passives onto a single packaging substrate for a cost-effective module solution. STATS ChipPAC says that the USB module has the flexibility to accommodate multiple die configurations and can be customised for each customer or end application. Integrating all of the key components of a USB flash drive into a single package saves considerable space and allows for more effective signal routing at a lower overall cost.

In a typical design for a USB drive, the NAND flash memory die and controller are packaged in thin small-outline package, quad flat pack or ball grid array packages. These packages may contain stacked dies, depending on the memory density requirements of the end application. The discrete NAND flash memory and controller along with passives are then mounted onto a printed circuit board using surface mount technology. This normally consumes most of the usable area allowed by the form factor of the USB flash drive.

"Semiconductor manufacturers in the NAND flash memory market face an intense challenge to increase memory density within a limited form factor and deliver a competitively priced end product to consumers," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC. He notes that the benefits of integrating key components of the USB drive at the packaging level are design flexibility, advanced die-stacking capability, reduced size and overall cost.

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