PoP, SiP, MCM, MCP or SoC: Weighing the trade-offs

Today, a package-on-package (PoP) concept is becoming widely accepted. Combo memory products combining multiple flash NOR and NAND with a RAM in a single package are widely used in cell phone applications. These single-package solutions are the MCP, system-in- package (SiP) and multi-chip module (MCM). View the PDF document for more information.