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PoP, SiP, MCM, MCP or SoC: Weighing the trade-offs

Posted: 28 May 0021     Print Version  Bookmark and Share

Keywords:multi-chip  SiP  PoP  SoC  MCP 

Today, a package-on-package (PoP) concept is becoming widely accepted. Combo memory products combining multiple flash NOR and NAND with a RAM in a single package are widely used in cell phone applications. These single-package solutions are the MCP, system-in- package (SiP) and multi-chip module (MCM). View the PDF document for more information.



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