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Samtec expands rugged interconnect line

Posted: 22 May 2008     Print Version  Bookmark and Share

Keywords:interconnect  board-to-board  cable-to-board 

Edge Rate

Samtec has expanded its line of Board-to-Board and Cable-to-Board solutions featuring its rugged Edge Rate contact. These systems are designed for applications where signal integrity and durability are critical. These specially designed contacts provide superior impedance matching, reduced broadside coupling and crosstalk, and high cycle life.

Board level systems include the robust 0,8mm (.0315") pitch Edge Rate interconnect strip system (ERM8/ERF8 Series) and the high speed RiseUp MicroCard stacking system (RU8 Series). SEARAY Open Pin Field Arrays (SEAM/SEAF Series) and DP Array Differential Pair Arrays (DPAM/DPAF Series) offer high-density solutions with maximum grounding and routing flexibility.

Cable-to-Board systems include the signal integrity optimised 0,8 mm (.0315") pitch, 50Ω micro coax Edge Rate strip (ERCDA Series) and 100Ω Twinax Data Bank high speed/high density systems (GCCA/GCAM Series), as well as the 100Ω Twinax MicroCard assembly (EEDP Series).

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