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Power/Alternative Energy  

Power integrity solution tout full integration

Posted: 22 May 2008     Print Version  Bookmark and Share

Keywords:chip-package-system  power integrity  co-design  co-analysis 

Apache Design Solutions introduces a new product from its family of Sentinel platforms, Sentinel-PI, which the company claims as the first fully integrated chip-package-system co-design and co-analysis solution for power integrity. The product provides SoC-aware modelling and analysis of the system level power delivery network for optimising designs from prototyping to system signoff.

Sentinel-PI boasts of its 3D, full-wave power network extraction and power integrity no-analysis engine for package and PCB designs. The new engine is said to deliver accurate, performance and capacity required for a complete chip-package-system co-analysis. The product also enables designers perform resistance check and static IR-drop analysis (DC), frequency-domain simulation including impedance analysis of multi-port power delivery network of the chip, package an board (AC), and time-domain dynamic voltage drop analysis (transient).

By embedding Chip Power Model (CPM), Sentinel-PI enables SoC-aware package/PCB power analysis all throughout the entire process. It enables accurate and predictable package selection as well as power pad and package decoupling capacitance optimisations. It also allows package and PCB designers to accurately run power integrity analysis of the package and the PCB with the power delivery network behaviours of the IC, diagnose potential chip-package LC resonance issues, and validate package/board dynamic voltage noise margin.

The Sentinel-PI will be available at Q3 of this year for Rs.14.01 lakh ($35,000) of time-based licence.

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