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Thick SOI substrates to make $115M in 2012

Posted: 20 May 2008     Print Version  Bookmark and Share

Keywords:MEMS  power electronics  SOI substrates 

Yole Dveloppement provides an analysis on thick silicon on insulator (SOI) substrates as this market is expected to move from Rs.288.15 crore ($72 million) in 2007 to Rs.460.24 crore ($115 million) in 2012.

Yole highlighted that MEMS applications and power electronics are leading in the thick SOI substrate market. According to the French market analyst, MEMS applications currently account for 38 per cent of the market and are set to exceed 45 per cent by 2012.

MEMS products such as accelerometers or gyroscopes will boost the thick SOI demand adding up to the expected 300,000 6-inch thick SOI substrates from MEMS-related activities in 2012.

Power electronics used to be the leading sector, as thick SOI was developed to produce some of the plasma TV (PDP) driver ICs. This trend is being reversed due to the competition from LCD technology. Yole notified that while the CAGR of thick SOI PDP-related business exceeded 25 per cent in the past years, the annual growth is expected to be only 6 per cent after 2008.

Yole also indicated that Japanese silicon wafer company SEH is the leading company on the thick SOI wafer market, followed by Japan-based Sumco. Asia provides about 75 per cent of all thick SOI wafers and is consuming 40 to 50 per cent of the total wafer volume in MEMS and power electronics.





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