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Qimonda signs with Winbond for 65nm DRAM

Posted: 24 Apr 2008     Print Version  Bookmark and Share

Keywords:65nm  DRAM  foundry 

Germany's Qimonda AG announced that it has signed a technology licence and foundry agreement with Taiwan's Winbond Electronics Corp. for its new 65nm "buried wordline" technology. Qimonda has had various foundry alliances with Nanya, Winbond, SMIC and others over the years.

Qimonda is also in discussions with other potential partners regarding its new DRAM technology. It disclosed the information during its quarterly results Apr. 21.

The German company recently announced a 4.5F2 cell technology that will let it extend its DRAM process to the 30nm node. The move also means that Qimonda is "abandoning its trench-capacitor technology in favour of more-conventional, stacked-capacitor technology," Gartner analyst Andrew Norwood wrote in a recent e-mail newsletter.

Meanwhile, the announcement with Winbond raises more questions about Nanya Technology Corp.'s own DRAM road map and its partnership with Qimonda. Nanya and Qimonda have a joint manufacturing venture in Taiwan called Inotera Memories Inc.

It would seem like Qimonda would initially work with Nanya on ''buried wordline''—instead of Winbond, observers speculated.

At the same time, Micron Technology Inc. recently entered a surprising R&D and DRAM partnership with Taiwan memory rival Nanya. Formed to share the soaring development and manufacturing costs for DRAMs, the alliance could be a threat to Qimonda and Inotera.

- Mark LaPedus
EE Times

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