Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > T&M

Moisture vs. plastic-packaged ICs

Posted: 04 Apr 2008     Print Version  Bookmark and Share

Keywords:acoustic imaging  delamination  corrosion 

Moisture from the atmosphere can have significant impact on the long-term reliability of a plastic-packaged component mounted on a board. Moisture, which is always accompanied by various contaminants, can cause electrical failures in two ways: by generating cracks and by promoting corrosion.

Tom Adams discusses the mechanics of faults supported by acoustic images. View the PDF document for more information.

Comment on "Moisture vs. plastic-packaged ICs"
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top