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Connectors offer high density to mezzanine apps

Posted: 08 Feb 2008     Print Version  Bookmark and Share

Keywords:board-stacking connector  Mezzanine connectors 

FCI has introduced its TwinMezz board-stacking connector, bringing ultra-high density to mezzanine applications while providing next-generation, high-speed electrical performance. The TwinMezz system packs 25 high-speed differential signal pairs in a square centimeter, or 161 signal pairs in a square inch, of board area.

A hermaphroditic design allows the TwinMezz connector to mate to itself, significantly reducing the number of part variations needed to accomplish a range of different stack heights, said FCI. Current plans are to support six different connector heights to offer 20 different stack heights in the range of 12mm to 40mm. Planned options for 2, 4, or 6 differential signal pairs per column will provide capability for circuit counts ranging from 80 to 800 contact positions.

The TwinMezz connectors exhibit very well-matched impedance, low insertion loss, and low crosstalk, which make them well-suited for applications in very high-speed environments, said FCI. The open pin field structure, building on the same edge-coupled technology used in FCI's AirMax VS high-speed connector system, allows for custom pin assignments so speed and signal density can be optimised. With optimised wiring patterns, transmission rates of 25Gbit/s or higher are achievable, according to the company.

TwinMezz connectors also feature FCI's patented BGA connector termination for easy attachment to PCBs using conventional reflow soldering processes. The TwinMezz connector system will be expanded during the first half of 2008 and, when in production, the product line will be part of FCI's MezzSelect product portfolio.

Today, eight of FCI's product families are part of the MezzSelect product portfolio. The MezzSelect program includes an on-line product selector, which is also available in printed copies.

- Gina Roos

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