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ST to ramp up Crolles2 wafer capacity

Posted: 25 Jan 2008     Print Version  Bookmark and Share

Keywords:Crolles2  fab capacity  wafer 

Now that Freescale Semiconductor Inc. and NXP Semiconductors have completed their withdrawal from the Crolles research and manufacturing site by ending all IC manufacturing activities within the Crolles2 Alliance, questions are being raised about the actual and future manufacturing capacity at Crolles2.

At STMicroelectronics' press and analysts conference in France this week, Alain Dutheil, ST's chief operating officer and vice chairman of the corporate executive committee, noted that the total capacity of Crolles2 was 2,500 wafers, adding that this could be raised to 2,800 wafers.

Dutheil further said that NXP and Freescale have left Crolles2 but "the capacity is still there. We are ramping up our production to the maximum capacity, which could be reached by the middle of the year."

Crolles2 is a high-profile alliance created in 2000 by STMicroelectronics and Philips Semiconductors (now NXP Semiconductors). Two years later, Freescale Semiconductors joined to collaborate on the research, development and industrialisation of CMOS process technologies, beginning at 90nm and ultimately attaining the 32nm node. Also that year, TSMC joined as an associate partner.

In January of 2007, the Alliance began to unravel when NXP disclosed that it would not extend its participation beyond the term expiring at the end of 2007. Instead, NXP decided to expand its ties with longtime foundry partner TSMC. Freescale followed the same route six months later.

- Anne-Francoise Pele
EE Times Europe

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