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Ralink joins AMD-driven Better by Design program

Posted: 22 Oct 2007     Print Version  Bookmark and Share

Keywords:AMD Better by Design  Ralink partner program 

802.11a/b/g/n chipset developer Ralink Technology Corp. is the newest recruit of the Better by Design program, an Advanced Micro Devices Inc, (AMD)-driven initiative. Launched in January, the Better by Design program aims to help OEM customers highlight AMD processor-based solutions that offer leading-edge performance.

"We are delighted to be selected as a participant in the Better by Design program," said Rick Jeng, President of Ralink Technology. "Working in concert with AMD's innovative platform technologies, Ralink's Wi-Fi chipsets help to deliver a heightened experience to the end user."

Induction into the Better by Design program requires wireless vendors to pass a strict regimen including performance and range testing to prove exceptional Wi-Fi capabilities. The vendor is also required to support the latest Wi-Fi features for security and quality of service (QoS) as well as comply with the latest Wi-Fi Alliance 802.11n Draft 2.0 specification.

"Ralink joins AMD and other industry leaders in enabling OEMs to deliver a superior PC experience for consumers and business professionals worldwide," said Chris Cloran, vice president, Notebook Division, AMD. "Ralink is another example of a company that brings the latest and greatest in terms of wireless performance and functionality."

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