ULC handset solutions leverage CEVA DSP core

NXP Semiconductors has selected CEVA Inc.'s CEVA-Teak DSP core for its highly integrated ultralow-cost (ULC) single-chip solutions targeting low-cost and entry-level handset designs for emerging markets.

Leveraging the processing performance and low power of the CEVA-Teak DSP core for baseband and voice processing, NXP's ULC single-chip solutions, PNX4901 and PNX4903, feature fully functional and completely integrated single-chip phone solutions. These GSM/GPRS solutions provide complete system-level operation in a single monolithic IC. Also, by providing the high levels of integration, they offer small, cost-effective solutions.

"We have established a strong record with this product line and by incorporating the CEVA-Teak DSP Core, NXP has access to an industry-leading DSP technology to meet the ever-growing development requirements in the high-volume, entry-level handset market," said Gideon Wertheizer, CEO of CEVA.

"The CEVA-Teak DSP core meets our requirements for baseband and voice processing capabilities, without compromising performance," said Dan Rabinovitsj, senior VP BL cellular of NXP. "Together with NXP's RF performance, NXP's single-chip solution for the ULC market delivers the smallest BOM and PCB footprint, along with the lowest manufacturing and test costs, for significant savings in ULC handsets."

CEVA-Teak is a 16-bit fixed-point general-purpose DSP core. Its dual MAC architecture features high performance, high flexibility and throughput for complex DSP implementations. The core is designed for low-power, speech and audio processing, multimedia and wireless communications (GSM, CDMA, EDGE, 3G), high-speed modems, advanced telecommunication systems and various embedded control applications.