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NIL, Oxford team to develop etch steps for nanoimprint tech

Posted: 25 Sep 2007     Print Version  Bookmark and Share

Keywords:nanoimprint lithography  etching steps  fabrication of structures 

NIL Technology A/S, a leading provider of stamps for nanoimprint lithography, has partnered with Oxford Instruments to develop new etch processes.

All three etching steps needed for the nanoimprint technology have been developed: etching of the NIL stamp in silicon and fused silica; removal of the residual layer after imprinting; and transfer of the pattern into the substrate (silicon or fused silica).

Nanoimprint lithography is a cost-effective and high-throughput method for fabrication of structures down to and below 10nm for applications such as data storage, optics and biosensors.

Oxford Instruments, based in Oxford, England, combined its expertise in plasma etching with NIL Technology's experience developing templates, stamps and processes to create methods for etching the nanoimprinting stamps in fused silica, de-scumming the imprinted polymer with negligible critical dimension loss, and etching the final structure.

"We saw an opportunity to work together to develop processes which are optimised as an overall end-to-end process rather than in individual steps," said Brian Bilenberg, chief technology officer at NIL Technology, based in Denmark.

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