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One piece interfaces suit high shock apps

Posted: 27 Aug 2007     Print Version  Bookmark and Share

Keywords:connectors  board stacking  high density array interconnects  connectors 

One Piece Interfaces

Samtec claims that its new family of One Piece Interfaces products that are well suited for high shock/vibration applications due to their robust design with threaded inserts to mount the connectors to the boards.

The devices can improve quality over elastermeric systems in pin-and-socket systems due to more reliable connections and elimination of bent pins, according to Samtec. They also provide low cost board stacking through low system cost by reducing the number of components required to be processed.

Dual row interfaces on 1mm (0.0394-inch) pitch (FSI Series) provide a range of board spacings from 3mm (0.118-inch) to 10mm (0.394-inch) between boards. For ultra low profile applications on 1mm (0.0394-inch) pitch, SEL Series provides 0.025-inch (0.64mm) and 0.050-inch (1.27mm) board spacing while SEI Series provides 0.065-inch (1.65mm) board space.

High-density array interconnects (GFZ Series) can achieve up to 1,200 I/Os and a 3mm (0.118-inch) board spacing profile, according to Samtec.

Specialty applications on 0.100-inch (2.54mm) pitch include one piece Power Interfaces (OPP Series), traditional strip style interfaces (SIB Series) and single and double row one piece Pogo style interface strips (PGP Series).




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