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TSMC's supports 45nm design with reference flow

Posted: 07 Jun 2007     Print Version  Bookmark and Share

Keywords:45nm methodology  design challenges  TSMC reference flow 

Taiwan Semiconductor Mfg Corp. (TSMC) has introduced its latest design methodology that supports the company's 45nm process technology with advanced standard cell, standard I/O, and SRAM compiler. The company claims that Reference Flow 8.0 increases yields, lowers risks and improves design margins.

"TSMC's 45nm process technology requires ever-deeper collaborations with EDA vendors and other partners in our design ecosystem," said Kuo Wu, deputy director of design service marketing at TSMC. "Reference Flow 8.0 provides a seamless link between the designers and advanced process technologies."

Reference Flow 8.0 supports TSMC's Active Accuracy Assurance initiative, which defines standards of accuracy for all partners in TSMC's design ecosystem, as well as for TSMC itself. According to the company, Reference Flow 8.0 focuses on ease of use, providing a reference of qualified design building blocks that give designers a proven path from specification to tape out. It not only supports 45nm, 65nm, and 90nm design rules, but also design flows for mainstream technologies from 0.13µm to 0.25µm.

Expanded offering
With Reference Flow 7.0, TSMC introduced what it claimed was the first foundry design methodology to include inter-die statistical timing analysis, which accurately determines the timing effects of manufacturing process variations.

Reference Flow 8.0 expands on this capability by offering intra-die statistical timing analysis along with statistical leakage and statistical timing optimisation. Statistical leakage provides a more precise analysis of leakage that reflects actual manufacturing outcomes. Statistical timing optimisation helps reducing the need for over-design and enables more effective timing closure. These features, says TSMC, enable designers to optimise design margins and increase yields.

TSMC also notes that the new design methodology offers enhancements in DFM methodology, allowing designers to address potential manufacturing challenges during the design process rather than post-processing after tape-out. In addition, Reference Flow 8.0 includes several power reduction techniques.

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