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MEMS microphone features high heat resistance

Posted: 22 May 2007     Print Version  Bookmark and Share

Keywords:slim MEMS microphone  1.05mm thick microphone  portable applications 

Matsushita Electronic Industrial has introduced a slim MEMS microphone that can help reduce the height of portable electronic appliances, as well as lower the mounting cost in their production process. Suitable for portable electronic devices such as mobile phones, the microphone is constructed from an acoustic transducer (MEMS chip) made of MEMS technology and a CMOS amplifier, realising low profile, at the same time, high heat resistance which enables Pb-free reflow solder mounting.

The device also features a high heat resistance of 260°C, which is required by Pb-free automatic reflow solder for PCB surface mounting.

The product also features less sensitivity change even after Pb-free reflow solder mounting (260°C, three times) with stable high heat resistance. Moreover, the newly developed CMOS amplifier enables portable electronic appliances to have low power consumption and achieve an "anti-noise" design.

The new MEMS microphone incorporates several technologies including a solid metal shield structure and mounting technology that helps realise the device's 1.05mm low profile. It also features a newly developed technology of high heat resistance inorganic multi-layer electret diaphragm formation and a CMOS amplifier design technology to enable low power consumption, low noise and low output impedance.

Sample shipment of the product will start by end of the month.

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