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3D X-ray inspection systems increase throughput

Posted: 02 May 2007     Print Version  Bookmark and Share

Keywords:X-ray inspection system  PCB assembly  3D coverage 

Agilent Technologies has claimed that its Medalist x6000 3D X-ray inspection systems offer more than double the throughput of leading 3D solutions. The system uses full 3D capability to find PCB assembly (PCBA) solder and manufacturing assembly defects.

The increased throughput of the Medalist x6000 offers two key benefits, said the company. First, it directly reduces the number of systems required to meet manufacturing volumes by cutting in half the required capital expenditures. Secondly, it enables complete 3D inspection of the entire PCBA at in-line speeds for high defect detection possible.

Double-sided PCBAs require 3D inspection so that users can discriminate between the top and bottom sides of boards where there is a high-density of solder joints. Typical communication and computation products can have an overlap of 35 per cent or more between the solder joints, which severely compromises the test coverage effectiveness of in-line 2D solutions for these products, said Agilent. The Medalist x6000 is said to deliver the high-throughput 3D coverage that can be used to inspect the entire board.

Moreover, for faster implementation, the Medalist x6000 incorporates several automatic test development features that help new users develop high-coverage programs in half the time previously required.

The Agilent Medalist x6000 will start shipping in May.

- Gina Roos

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