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Spansion, Qimonda partner in memory subsystems

Posted: 13 Apr 2007     Print Version  Bookmark and Share

Keywords:flash memory solutions  memory subsystem  mobile devices 

Spansion Inc. and Qimonda announced they have signed a strategic supply agreement that will combine Qimonda's low-power DRAM with Spansion's MirrorBit NOR and ORNAND devices into MCP memory solutions for mobile devices.

The companies also plan to align product roadmaps, particularly providing Qimonda pseudo RAM (PSRAM) devices specified for certain Spansion flash memory, which is expected to result in improved yields and cost-effective solutions that can bring more efficiency to handset OEMS.

Under the terms of the agreement, Qimonda will provide Spansion with its low-power CellularRAMs or PSRAM, and Mobile-RAM devices in Known Good Die (KGD) form, which Spansion will use in MCP solutions. The term KGD means that Qimonda performs all functional and quality testing of the dies on the finished wafer, which are then stacked with Spansion Flash memory in a compact MCP.

"We have strategically selected companies such as Qimonda that will optimise DRAM for our Flash memory solutions to enable our customers to introduce innovative handsets quickly and cost-effectively," said Sudesh Bhikha, VP of business operations, wireless solutions division at Spansion.

"By delivering KGDs for assembly in a variety of total densities and interfaces, we are contributing to the development of a family of MCP devices for the mobile market," said Ayad Abul-Ella, VP and general manager of the mobile and consumer business unit at Qimonda.

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