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Manufacturing/Packaging  

High pulse energy laser doubles process throughput

Posted: 10 Apr 2007     Print Version  Bookmark and Share

Keywords:LAMBDA SX excimer laser  LAMBDA SX 540C  excimer laser double repetition rate 

Coherent Inc. has unveiled a higher power version of their LAMBDA SX class of high pulse energy lasers at 308nm. Targeted at high-throughput manufacturing applications, the LAMBDA SX 540C is said to be the first industrial-grade excimer laser to deliver both high pulse energy (up to 0.9J) and a high pulse repetition rate (up to 600Hz). This repetition rate is twice that of earlier models, which translates directly into higher process throughput.

The new laser incorporates the advantages of the existing LAMBDA SX class and several important innovations. For example, actively stabilised performance can be achieved at pulse energies anywhere between 700-900mJ, enabling the laser output and operating costs to be optimised for specific applications needs.

The laser also features burst mode with PowerLok for power-on-demand applications, an all solid-state power supply for high reliability, and an external resonator design for maximum beam stability. Plus, the use of TimeLok technology ensures accurate triggering and time jitter reduction. Moreover, with the LAMBDA SX 540C laser, Coherent introduces an enhanced software interface for improved real-time control, greater ease of use, implementation of remote e-diagnostics and optimised maintenance scheduling.

The LAMBDA SX series promises the lowest cost per UV W/h for a range of high duty cycle industrial processing tasks. These include high-throughput micromachining and surface treatment of a variety of plastics and glass materials, structuring of Transparent Conductive Oxides like ITO, ZnO, direct patterning of thin metal films on flexible plastic substrates, thin film annealing and reel-to-reel Pulsed Laser Deposition (PLD). All LAMBDA SX lasers can be combined with Coherent's MicroLas standard or custom beam delivery optical systems to yield a spatial resolution as small as 2µm at the work surface in these applications.




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