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Test, burn-in sockets accept 0.40mm pitch devices

Posted: 18 Jan 2007     Print Version  Bookmark and Share

Keywords:DSP  flash memory  test sockets  Aries  DRAM 

Test sockets from Aries

Aries Electronics has announced that all sizes of its CSP/Micro BGA test and burn-in sockets accept devices with pitches as low as 0.40mm. These sockets can be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices.

The sockets are offered in four sizes?for device packages that measure up to 13mm?, 14-27mm?, up to 40mm? and up to 55mm?. They provide minimal signal loss for higher bandwidth capability via a signal path of 1.95mm, and their solderless, pressure-mount compression spring probes allow them to be easily mounted to and removed from the test board, said the company.

Each socket's small overall profile allows the maximum number of sockets per board, and boards per oven. The 4-point spring probe crown ensures "scrub" on solder ball oxides for reliable contact mating, and the gold-over-nickel plated compression spring probe screws leave very small witness marks on the bottom of the device solder balls.

The test and burn-in sockets feature compression spring probes that are heat-treated beryllium copper alloy, plated with 0.75?m gold per Mil-G-45204 over 0.75?m nickel per SAE-AMS-QQ-N-290. Their moulded components are UL94V-0 PEEK and/or Ultem and all hardware is constructed of stainless steel. Contact forces of the sockets are 16g per contact for 0.40mm pitch and 25g per contact for 0.50mm pitches and larger. The operating temperature is -55?C to 150?C. Estimated contact life is more than 500,000 cycles.

Pricing for a 50-lead socket starts at Rs.4,305.40 ($95) each for 25 pieces. Delivery is four to six weeks.

- Gina Roos
eeProductCenter




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