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NCP encapsulant suits flip-chip image sensor apps

Posted: 02 Jan 2007     Print Version  Bookmark and Share

Keywords:image sensor  encapsulant  NCP underfill  Henkel  non-conductive paste 

Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said to provide adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.

Like other materials in Henkel's NCP product portfolio, Hysol FP5110 provides an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, which simplifies flip-chip assembly and eliminates the need for flux application, reflow and cleaning, said the company. In addition, the material may be used as a replacement for manual anisotropic conductive film (ACF) processes for image sensor assemblies.

Hysol FP5110 is compatible with thermal compression and ultrasonic bonding processes. It also features an energy-saving, low temperature 10s SnapCure at 180°C, and storage requirements of -15°C, which is said to help eliminate freeze thaw voids often associated with -40°C storage, said the company.

- Gina Roos

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