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AIT granted lead frame U.S. patent

Posted: 06 Dec 2006     Print Version  Bookmark and Share

Keywords:AIT  leadframe 

Advanced Interconnect Technologies (AIT) was granted U. S. patent number 7,129,116 dated Oct. 31 for developing a process for the manufacture and use of partially patterned lead frames with near-chip scale packaging lead-counts.

The patented lead frame technology enables high design flexibility, package reliability and performance for quad flat no-lead (QFN) style packages including etched leadless package (ELP). Compared to other available technologies, the lead frame process creates smaller QFN packages with increased I/O and smaller footprint.

"Our patented lead frames provide an array of competitive advantages to our QFN packages, which are ideally suited for the development of small, low-cost mobile devices," said Mike McKerreghan, chief operating officer, AIT. "This provides our customers the much needed edge to compete in the rapidly expanding wireless consumer market."

The lead frame patent is said to address the need for robust assembly process and the demand for higher reliability at die-to-package interconnects and die-to-die bonding.

"We can achieve assembly efficiency and reliability by designing our lead frame as a partially patterned strip of metal," said McKerreghan. "One side of the lead frame is shaped into a web-like surface while the other side is solid and flat. This distinctive design makes the leadframe mechanically rigid and thermally robust eliminating distortion and deformation during the chip-attach and wire bond processes both at the chip level and at the package level. Our patented process thereby ensures a high throughput for our customers."

The patterned leadframes also offer reliable singulation without cutting into additional metal. The bottom side of the metal leadframe is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is encapsulated. "The resultant package is electrically isolated and enables pre-singulation strip testing and a longer saw blade life as there is no additional metal cutting," said McKerreghan.

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