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Samsung takes wrap off 16-chip MCP tech

Posted: 03 Nov 2006     Print Version  Bookmark and Share

Keywords:Samsung Electronics Co. Ltd  multi-chip package  MCP  NAND 

Samsung Electronics Co. Ltd has developed what it touts as the industry's 'first' process to enable the production of a 16-chip multi-chip package (MCP) of memory.

The MCP technology supports industry-wide demand for small form factors and high-densities that will accommodate multimedia-intensive user applications. When applied to 8Gbyte NAND flash chips, the 16-chip MCP technology can enable up to a 16Gbyte MCP solution. Advanced MCP technology requires a combination of key processes such as wafer thinning technology, redistribution layer technology, chip sawing technology and wire bonding technology.

To increase the number of chips stacked vertically, the need for further wafer thinning was a critical design obstacle. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 of the thickness of each fabricated-wafer to reduce overall thickness to only 30μm. This is 65 percent the thickness of the 45μm-thick 10-chip MCP wafer which Samsung developed last year and similar to the size a human cell, which measures 20- to 30μ.

As part of its MCP breakthrough, Samsung also developed a new laser-cutting technology to cut the wafer into individual chips. This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80μ thick, explained Samsung.

To vertically stack identically-sized dies or chips, a redistribution layer technology is also applied in the new multi-stack MCP process, to enable wafer fabricators to adhere the wire contacts from just one side, unlike the conventional method of extending wire connection from both sides of each chip. Along with a single wire contact per die, the dies are placed in a zigzag stack to minimize the use of space and the length of the wire connectors. Moreover, the thickness of the adhesive has been reduced to 20μm, bringing the height of a16-die stacked height to 1.4mm. Note that a 10-chip MCP uses 60μm adhesive layer and has a total height of 1.6mm.

Samsung added that the new 16-chip MCP package technology provides high density solution for the creation of slimmer consumer electronics, in response to the increasing demand for more multimedia features in mobile devices.

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