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Power MOSFETs feature 'smallest' footprint

Posted: 20 Jul 2006     Print Version  Bookmark and Share

Keywords:NEC Electronics  μPA2350  μPA2351  power MOSFETs 

NEC Electronics' μPA2350 and μPA2351 power MOSFETs, boasting the industry's smallest footprint for its class of low-voltage MOSFETs, reduce the design footprint of traditional dual n-channel devices by as much as 86 per cent compared to current industry solutions such as the 8-pin TSSOP. As such, the devices, measuring 1.62mm2 by 0.48mm thick, are designed to reduce the size of Li-ion battery packs in ever-shrinking consumer products such as cell phones, digital cameras and other mobile devices.

"An innovative use of chip-scale packaging technology allowed NEC Electronics to develop MOSFETs that have the industry's lowest on-state resistance and smallest package to address the stringent battery power and performance requirements of evolving portable consumer electronics products," said Minoru Matsuda, general manager, Power Management Devices Division.

The devices combine the company's fourth-generation UMOS process technology with a chip-on-board packaging technique that results in low on-state resistances of 28 milliohms (μPA2350) and 32 milliohms (μPA2351) to extend battery life. In compliance with the RoHS directive, both devices, including the bump contacts used to connect the chips to the boards, are completely Pb-free. Integrated gate-protection diodes result in lower overall system costs and smaller form factors.

Both power MOSFETs are sampling now and are scheduled for volume production in August. Pricing for both parts is Rs.16.04 (35 cents) each in 10,000-unit quantities. Pricing and availability are subject to change.

- Vince Biancomano

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