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ST, Semikron partner to deliver integrated power modules

Posted: 21 Apr 2006     Print Version  Bookmark and Share

Keywords:STMicroelectronics  Semikron International  power devices 

Semikron International and STMicroelectronics (ST) are teaming up to develop and deliver integrated power modules for industrial, consumer and automotive markets, embedding ST's power devices in Semikron's SEMITOP power packages. The two companies have agreed to combine their complementary competences to offer robust and cost-effective power solutions and use the new module range to expand their respective market coverage.

According to the press release, this collaboration creates opportunities for traditional power devices, including Insulated-Gate Bipolar Transistor (IGBT) and power MOSFETs as well as for ST's proprietary Emitter-Switched Bipolar Transistor (ESBT) devices, which cost-effectively combine power bipolar and power MOSFET structures to offer both high voltage capability and high switching frequencies.

The SEMITOP package allows several chips, such as IGBTs, diodes and input bridge rectifiers, to be integrated in a single module. Package-level integration reduces the component count and board space of discrete solutions, while ensuring superior connectivity and inherent reliability. The two company added that the use of advanced processes and materials, including direct bond copper ceramic substrate and internal gel coating, results in excellent thermal management and immunity to external temperature variation and mechanical stress.

The integrated power modules from ST and Semikron are set to address the rapidly growing demand for more integrated and reliable high-power platforms in a wide range of segments and applications, including welding, UPS, home appliance, motor drive and switched mode power supplies.

"The partnership with ST guarantees that higher volumes can be produced and the established existing range can be expanded," commented Riccardo Ramin, SEMITOP product manager at Semikron.

Volume production of the integrated power modules will start in Q2 2006.

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