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VIA Tech plans innovation centre

Posted: 23 Feb 2006     Print Version  Bookmark and Share

Keywords:VIA Technologies Inc.  power heat dust  accessible computing 

Taiwan based VIA Technologies Inc. is planning the VIA Technology Innovation Centre in Mumbai to develop its Power Heat Dust (PHD) computing and connectivity appliances. The appliances will tackle power, heat, dust and other environmental challenges in developing markets.

The centre will help deliver affordable and accessible computing "to the next one billion people" across the developing world through the VIA PC-1 Initiative, according to the company. The company also stated that the VIA Technology Innovation Centre in Mumbai will work closely with government, industry, and educational institutes such as the IITs in various parts of the country, to define and develop affordable PHD appliances.

The centre will also work on the development of advanced server appliances featuring wireless mesh networking technologies for high bandwidth "last mile" Internet access in both urban and rural communities. "Last-mile connectivity has major cost and logistics implications for both developed and developing nations alike, for which wireless mesh technologies can provide a viable solution," said Richard Brown, VP, corporate marketing. "By focusing on creating innovative wireless connectivity solutions, the VIA Technology Innovation Centre can help us achieve our goal of much wider access to the benefits of computing and connectivity."

- Ritesh Gupta
 : EE Times India




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