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FlipChip starts constructing bumping facility

Posted: 14 Feb 2006     Print Version  Bookmark and Share

Keywords:wafer-level packaging  flip-chip bumping  FlipChip  Millennium Microtech 

FlipChip International LLC has disclosed that it started construction of an advanced bumping facility for a joint venture in China with Millennium Microtech (Shanghai) Co. Ltd (MMS). The joint venture will provide wafer-level packaging and flip-chip bumping services to the domestic and international semiconductor market, said the press release. The joint venture will be referred to as FCMS and will be located at MMS's existing Pu Dong facility.

According to FlipChip president and CEO Bob Forcier, the domestic consumption of flip-chip devices is expected to maintain double digit growth for the next three years and is an essential packaging technology for wireless portable devices and video phones.

FlipChip is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. It is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for wireless infrastructure in the life science, renewable energy and homeland security markets.

MMS is a subsidiary of Millennium Microtech Holding (MMH). MMH provides fully integrated semiconductor packaging and test services, including dicing, tape and reel, wafer probing, and back-grinding through MMS and Millennium Microtech (Thailand) Co. Ltd.

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