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IRC substrate improves thermal conductivity

Posted: 30 Nov 2005     Print Version  Bookmark and Share

Keywords:substrate  thermal conductivity 


IRC Inc.'s Advanced Film Division has developed a substrate technology that offers significant benefits over conventional polymer-based insulated metal substrates (IMS). Anotherm, IRC's new material consists of a thermally-conductive aluminium alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen printed conductors applied to the anodized layer.

"The Anotherm process utilizes low cost manufacturing methods which result in a product that is compatible with traditional surface mount technology assembly methods," said Tom Morris, applications engineering manager for IRC's Advanced Film Division.

Traditional insulated metal substrate technology (IMS) often relies on a polymer or epoxy material that is mechanically applied to a bare aluminium substrate, which requires extensive surface preparation as well as a minimum thickness of approximately 75µm. Traditional IMS technology is also delaminates at high temperatures.

The Anotherm process chemically converts the surface of the base aluminium itself to a rugged anodized insulating layer with a uniform thickness of only 35µm, giving the substrate its superior thermal properties, as well as eliminating the potential for delamination.

The Anotherm substrates utilize an additive process that has fewer process steps than the subtractive process typically used for IMS board manufacturing, according to Morris. This allows improved flexibility, thermal efficiency and cost savings.

Typical applications for the Anotherm substrate include high-brightness LED assemblies, LED packages, and power resistors for automotive applications.

Maximum operating voltage for Anotherm substrates is 250VAC, with thermal impedance at 0.2°C/W. Maximum continuous operating temperature is 400°C without a solder maskant and 175°C with a solder maskant.

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