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Phase-change material meets thermal requirements of advanced ICs

Posted: 28 Nov 2005     Print Version  Bookmark and Share

Keywords:Laird Technologies  Thermagon  T-pcm 583  phase change material  thermal resistance 

high-performance phase change material

Laird Technologies Thermal Products (formerly known as Thermagon) introduced a new high-performance phase-change material, designated as T-pcm 583, that meets the thermal resistance and reliability requirements needed for advanced applications like microprocessors, chipsets, graphic processing chips and custom ASICs for next-generation consumer electronics.

T-pcm 583 is a non-electrically conductive film that is naturally tacky at room temperature and does not require additional adhesives or pre-heating for assembly, according to the company. The application pad begins to soften and flow at 50?C, which fills the microscopic irregularities of both the component and thermal solution, to reduce thermal interface resistance.

T-pcm 583 is supplied in strips or rolls with a top-tabbed liner for easy application. Individually die cut shapes also are available. T-pcm 585 is priced at less than Rs.3.20 (7 cents) per inch? in large volume applications.

- Gina Roos

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