Global Sources
EE Times-India
Stay in touch with EE Times India
 
EE Times-India > RF/Microwave
 
 
RF/Microwave  

India, Japan ink pact for R&D, JVs

Posted: 26 Aug 2005     Print Version  Bookmark and Share

Keywords:broadband  mobile communication  information security 

India and Japan have signed three agreements during a ministerial forum to identify possible joint ventures and stand-alone projects in broadband, mobile communication, information security, R&D and ubiquitous computing.

The pact was signed in New Delhi by India's communications and information technology minister, Dayanidhi Maran, and Taro Aso, Japan's minister of internal affairs and communications.

The partners will form government-industry working groups to propose a detailed plan to implement programs.

India's Center for Development of Telematics, Center for Development of Advanced Computing and the Indian Institute of Technology will undertake joint programs in R&D and training engineers along with NICT of Japan, according to statement.

"India's cost effective and innovative software skills can be productively aligned with Japan's undoubted prowess in the hardware industry," Maran said in a statement.

- K.C. Krishnadas

EE Times





Comment on "India, Japan ink pact for R&D, JVs"
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

 
Back to Top