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Singapore packager to expand flip-chip capacity

Posted: 02 Sep 2005     Print Version  Bookmark and Share

Keywords:flip-chip assembly  dsp 

Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly. As a result, the company's flip-chip capacity is expected to reach several million units per month by the first quarter of 2006, the company said.

STATS ChipPAC (Singapore) did not state what the level of flip chip packaging capacity it currently maintains. "Although high-end flip chip applications drive the technology curve, flip chip technology is spreading beyond more traditional applications such as high-performance ASICs and graphics into products such as DSPs and integrated 3D packages for mobile platforms," said Scott Jewler, chief strategy officer at STATS ChipPAC, in a statement. "This in turn is driving more demand for flip chip capacity from wafer bump to sort, assembly, and test," he added.

- Peter Clarke

EE Times

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