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Manufacturing/Packaging  

Lead-free soldering for the attachment of µBGA packages

Posted: 07 Jun 2001     Print Version  Bookmark and Share

Keywords:tessera  bga  packaging  chip package  lead free solder 

This application note will focus on review of alternative solder alloy compositions, furnish recommendations for solder process development, and review environmental testing requirements, comparing eutectic solder to lead-free solder on a 46 I/O µBGA package.

View the PDF document for more information.



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