Global Sources
EE Times-India
Stay in touch with EE Times India
EE Times-India > Manufacturing/Packaging

Dual footprint layout for 16Mb and 64Mb TSOP packages

Posted: 25 Sep 2001     Print Version  Bookmark and Share

Keywords:memory  sdram  esdram  hsdram  package 

This application note proposes support for both 16Mb and 64Mb SDRAM densities by creating board layouts for devices soldered down to the system board.

View the PDF document for more information.

Comment on "Dual footprint layout for 16Mb and 6..."
*  You can enter [0] more charecters.
*Verify code:


Visit Asia Webinars to learn about the latest in technology and get practical design tips.


Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top