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TAB tape carrier with micro plating bumps for burn-in testing socket

Posted: 20 Jun 2002     Print Version  Bookmark and Share

Keywords:ic package test  bga package test  burn in testing socket  test probe  test lead 

This application note describes the use of a new contact substrate for the burn-in testing socket for 0.5mm-pitch BGA package.

View the PDF document for more information.

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